
Prototype Package
Schematic capture up to 50 components
2 to 4-layer PCB layout up to 100mm x 100mm
Gerbers, BOM, Pick-and-Place
Production Package
Multi-layer layout up to 18 layers
High-speed routing (DDR, USB, Ethernet, etc)
DFM/DFT review and stack-up guidance
Deliverables: Gerbers, ODB++, IPC-356, BOM, CPL
KiCad schematic capture, custom symbol/footprint library creation, ERC checks and design documentation.
2-16 layer boards, controlled impedance, high-speed routing, differential pairs, DDR, USB, Ethernet.
Gerbers/ODB++, IPC-356 netlist, BOM, pick-and-place, fab drawings, DFM/DFT review and CAM checks.